1. Test items:
① Electrode size detection
② Front and back alignment detection
③ Appearance inspection of defects
④ Closed-loop correction
⑤ Comparison of dry and wet material data

2. Optional content:
① Deviation correction control system
② Defect inkjet marking system
③ AI recognition
④ CCD detection of the front and back sides of the oven outlet

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  Thin Film Industry

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  Semiconductor Industry

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